Title :
Foreword - polymeric materials for electronics packaging
Author_Institution :
Chalmers University of Technology
Keywords :
Capacitive sensors; Conductive adhesives; Contact resistance; Dielectric materials; Electronics packaging; Lead; Manufacturing; Materials science and technology; Paper technology; Polymers;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2000.868838
