DocumentCode
1382064
Title
Foreword - polymeric materials for electronics packaging
Author
Liu, Jiangchuan
Author_Institution
Chalmers University of Technology
Volume
23
Issue
3
fYear
2000
Firstpage
419
Lastpage
419
Keywords
Capacitive sensors; Conductive adhesives; Contact resistance; Dielectric materials; Electronics packaging; Lead; Manufacturing; Materials science and technology; Paper technology; Polymers;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2000.868838
Filename
868838
Link To Document