• DocumentCode
    138217
  • Title

    Modeling and simulation of monolithic integration of rectifiers for solid state lighting applications

  • Author

    Venkatesh, M.R. ; Liu, Peng ; van Zeijl, H.W. ; Zhang, G.Q.

  • Author_Institution
    DIMES Res. Center, Delft Univ. of Technol., Delft, Netherlands
  • fYear
    2014
  • fDate
    7-9 April 2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    In this paper, a design methodology for modelling and simulation of monolithic integration of low power rectifier for solid state lighting application is presented. The power conversion is built based on Schottky diode fabricated in a standard BiCMOS process. The process simulation is done by using TSUPREME4 to study the doping profiles and junction depth of the standard BiCMOS fabrication steps. The modelling and design of the Schottky diode for rectifier design is then made with inputs from the process simulation tool. COMSOL Multiphysics environment is used to couple both semiconductor module and circuit analysis steps. The simulated IV characteristics of the Schottky diode are used to build the SPICE model parameters of the fabricated device. A model for monolithically integrated rectifier application and analysis is presented and analysed.
  • Keywords
    BiCMOS integrated circuits; SPICE; Schottky diodes; doping profiles; finite element analysis; integrated circuit manufacture; lighting; low-power electronics; power conversion; rectifying circuits; solid-state rectifiers; COMSOL Multiphysics environment; SPICE model parameter; Schottky diode design; Schottky diode fabrication; Schottky diode modelling; TSUPREME4; circuit analysis; doping profile; junction depth; low power rectifier design; monolithically integrated rectifier application; power conversion; semiconductor module; solid state lighting applications; standard BiCMOS process simulation tool; Abstracts; Integrated circuit modeling; Nonlinear optics; Optical polymers; Schottky barriers; Schottky diodes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on
  • Conference_Location
    Ghent
  • Print_ISBN
    978-1-4799-4791-1
  • Type

    conf

  • DOI
    10.1109/EuroSimE.2014.6813865
  • Filename
    6813865