Reliability and failure analyses of thermally cycled ball grid array assemblies

Author

Ghaffarian, Reza ; Kim, Namsoo P.

Author_Institution

Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA

Volume

23

Issue

3

fYear

2000

fDate

9/1/2000 12:00:00 AM

Firstpage

528

Lastpage

534

Abstract

The reliability of ball grid arrays (BGAs) was assessed as part of a consortium effort led by the Jet Propulsion Laboratory. Nearly 200 test vehicles, each with four packages, were assembled and tested using an experiment design. The most critical variables incorporated in for the experiment were package types, ceramic and plastic; board materials, FR-4 and polyimide; surface finishes, OSP, HASL, and Ni/Au; solder volumes, low, standard, and high; and environmental conditions. Thermal cycling test results to 3000 cycles for ceramic packages with 625 inputs/outputs (I/Os) and depopulated full array plastic packages with 313 I/Os were presented in a previous paper by the authors (see Proc 30th Int. Symp. Microelectron., Philadelphia, PA, Oct. 1997, p. 396-400). This paper presents the most current thermal cycling test results (>6000 cycles) for plastic OMPAC and SuperBGA packages with 352 I/Os and 560 I/Os. Failure mechanisms detected by electrical continuity interruptions as well as optical and scanning electron microscopy results are also compared for ceramic and plastic package assemblies

Keywords

ball grid arrays; ceramic packaging; failure analysis; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; plastic packaging; scanning electron microscopy; FR-4; Ni-Au; SEM; SuperBGA packages; ball grid array assemblies; board materials; ceramic packages; electrical continuity interruptions; environmental conditions; failure analyses; failure mechanisms; full array plastic packages; optical microscopy; package type; plastic OMPAC packages; polyimide; reliability; scanning electron microscopy; solder volumes; surface finishes; thermal cycling test; thermally cycled BGA assemblies; Assembly; Ceramics; Electronics packaging; Failure analysis; Laboratories; Optical microscopy; Plastic packaging; Propulsion; Testing; Vehicles;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/6144.868853

Filename

868853