Title :
A Low-Complexity Decoding Algorithm for Coded Hierarchical Modulation in Single Frequency Networks
Author :
Zixia Hu ; Hong Jiang ; Hongxiang Li ; Zhiyong Chen ; Hui Liu
Author_Institution :
Qualcomm Inc., San Jose, CA, USA
Abstract :
In this paper, the hierarchical modulation (HM) technique is adopted in a single frequency network (SFN) to provide both global and local information. In order to mitigate the interlayer interference and intercell interference, we develop a low-complexity successive interference cancellation (SIC) algorithm for the coded HM signals in the SFN. The proposed decoding algorithm can be applied to different soft-decision channel coding schemes (e.g., Turbo codes, LDPC codes) under various channel profiles. We analyzed the decoding complexity of the proposed algorithm, and evaluated the bit error rate performance. The simulations show that the new decoding algorithm can offer up to 0.7 dB carrier to noise ratio ((C/N)) gain compared with the traditional SIC approach under different channel models, while providing the comparable performance (up to 95% decoding complexity savings) with the multilayer iterative decoding approach. The performance evaluation and decoding complexity comparisons indicate that the proposed structured SIC approach offers a good performance-complexity trade-off, especially for the HM-based SFN scenarios.
Keywords :
channel coding; error statistics; interference suppression; iterative decoding; modulation coding; SIC; bit error rate performance; carrier-to-noise ratio; coded hierarchical modulation; decoding complexity; intercell interference; interlayer interference; low-complexity decoding algorithm; multilayer iterative decoding; single frequency networks; soft-decision channel coding; successive interference cancellation; Complexity theory; Decoding; Interference; Iterative decoding; Phase shift keying; Silicon carbide; Transmitters; Hierarchical modulation; low decoding complexity; single frequency network; structured SIC;
Journal_Title :
Broadcasting, IEEE Transactions on
DOI :
10.1109/TBC.2014.2318554