Thermal dynamics and the time constant domain

Author

Székely, Vladimir ; Rencz, Márta

Author_Institution

Dept. of Electron Devices, Tech. Univ. Budapest, Hungary

Volume

23

Issue

3

fYear

2000

fDate

9/1/2000 12:00:00 AM

Firstpage

587

Lastpage

594

Abstract

The time-constant spectrum representation is a useful description of the dynamic thermal behavior of packages, assemblies and microsystems. After presenting the idea of the time constant spectrum representation of microelectronic structures, the paper provides an algorithm that can be used for time constant spectrum calculation in thermal simulator programs. The obtained time-constant spectrum can be the basis of calculating the transient behavior pulse thermal resistance diagrams, and structure reconstruction. All these applications are presented in the paper with examples

Keywords

digital simulation; packaging; reduced order systems; thermal resistance; transient analysis; dynamic thermal behavior; microelectronic structures; pulse thermal resistance diagrams; spectrum calculation; spectrum representation; structure reconstruction; thermal dynamics; thermal simulator programs; time constant domain; transient behavior; Assembly; Capacitance; Circuits; Frequency domain analysis; Impedance; Microelectronics; Packaging; Reduced order systems; Thermal engineering; Thermal resistance;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/6144.868862

Filename

868862