Title :
An avionics guide to uprating of electronic parts
Author :
Humphrey, David ; Condra, Lloyd ; Pendsé, Neeraj ; Das, Diganta ; Wilkinson, Chris ; Pecht, Michael G.
Author_Institution :
Honeywell Inc., Tucson, AZ, USA
fDate :
9/1/2000 12:00:00 AM
Abstract :
Avionics applications generally require parts that operate reliably in temperature ranges much wider than the commercial 0-70°C ranges. However, the availability of electronic parts rated for operating temperature ranges wider than 0-70°C is decreasing, as semiconductor manufacturers gradually abandon the nonprofitable military markets and their wide operating temperature range parts. The focus of the semiconductor manufacturers is largely on commercial applications e.g., computers, audiovisual equipment, and cellular phones. One way of meeting this availability problem for parts is “uprating.” Uprating is a process to assess the ability of a part to meet the functionality and performance requirements of the applications in which the part is used outside the manufacturers´ specification range. An Avionics Working Group and the CALCE Electronic Products and Systems Consortium at the University of Maryland has developed a guidebook consisting of methods for uprating electronic parts. This article presents an overview of these methods including definitions and descriptions
Keywords :
avionics; reliability; thermal management (packaging); avionics applications; avionics guide; commercial applications; electronic parts; functionality; guidebook; operating temperature ranges; performance requirements; uprating; Aerospace electronics; Application software; Availability; Computer aided manufacturing; Computer applications; Consumer electronics; Electronic equipment manufacture; Military computing; Semiconductor device manufacture; Temperature distribution;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/6144.868863