DocumentCode :
138243
Title :
Assessment of microelectronics interconnect reliability - current practice and trends
Author :
Borgesen, P.
Author_Institution :
Dept. of Syst. Sci. & Ind. Eng., Binghamton Univ., Binghamton, NY, USA
fYear :
2014
fDate :
7-9 April 2014
Firstpage :
1
Lastpage :
5
Abstract :
When it comes to the long-term reliability of the most common microelectronics interconnects, too little effort is spent on investigating important aspects while a significant amount of day-to-day reliability testing may be more or less wasted. This would seem to be at least partially so because reliability managers often fail to ask themselves what it is that they really want to know. Notably, while rarely explicitly recognized even ongoing `engineering tests´ will usually be meaningless unless they reveal something about relative performance in service. This requires a model or at least a quantitative mechanistic understanding.
Keywords :
integrated circuit interconnections; integrated circuit reliability; day-to-day reliability testing; engineering tests; long-term reliability; microelectronics interconnect reliability assessment; Market research; Reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on
Conference_Location :
Ghent
Print_ISBN :
978-1-4799-4791-1
Type :
conf
DOI :
10.1109/EuroSimE.2014.6813880
Filename :
6813880
Link To Document :
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