• DocumentCode
    138277
  • Title

    Wide frequency band assessment of 28 nm FDSOI technology platform for analogue and RF applications

  • Author

    Makovejev, S. ; Esfeh, B. Kazemi ; Barral, V. ; Planes, N. ; Haond, M. ; Flandre, Denis ; Raskin, Jean-Pierre ; Kilchytska, V.

  • Author_Institution
    ICTEAM Inst., Univ. catholique de Louvain, Louvain-la-Neuve, Belgium
  • fYear
    2014
  • fDate
    7-9 April 2014
  • Firstpage
    53
  • Lastpage
    56
  • Abstract
    This work presents an in-depth wide-frequency band assessment of 28 nm FDSOI MOSFETs for analogue and RF applications. The focus is mainly on such figures of merit (FoM) as the transconductance gm, the output conductance gd, the intrinsic gain Av and the cut-off frequencies ft and fmax. Firstly, 28 nm FDSOI MOSFETs are compared with other advanced devices and are shown to outperform them. Secondly, gm-Av analogue metrics is demonstrated to be affected by operation frequency. Small-signal parameters variation is limited and dominated by self-heating effect. This is in contrast to the first generation of ultra-thin body and BOX devices without a ground plane where coupling through the substrate has a considerable effect. Thirdly, the self-heating effect is analysed and shown to be smaller than previously predicted by simulations for such devices. Fourthly, it is shown that ft reaches ~270 GHz in the shortest devices.
  • Keywords
    MOSFET; silicon-on-insulator; BOX devices; FDSOI MOSFETs; FDSOI technology platform; FoM; RF applications; analogue applications; cut-off frequency; figures of merit; fully-depleted silicon-on-insulator; ground plane; intrinsic gain; output conductance; self-heating effect; size 28 nm; small-signal parameter variation; transconductance; ultra-thin body generation; wide frequency band assessment; Frequency dependence; Immune system; Logic gates; MOSFET; Radio frequency; Substrates; Thermal resistance; RF; SOI; UTBB; analogue FoM; self-heating;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultimate Integration on Silicon (ULIS), 2014 15th International Conference on
  • Conference_Location
    Stockholm
  • Type

    conf

  • DOI
    10.1109/ULIS.2014.6813904
  • Filename
    6813904