DocumentCode
138286
Title
Multiphysics modeling of thin piezoelectric transducers integrated in flexible substrates
Author
Ardila, G. ; Tao, R. ; Montes, L. ; Mouis, M.
Author_Institution
IMEP-LAHC, Univ. de Savoie, Grenoble, France
fYear
2014
fDate
7-9 April 2014
Firstpage
77
Lastpage
80
Abstract
The combination of processing technologies, low power circuits and new materials integration makes it conceivable to build autonomous integrated systems, which would harvest their energy from the environment. In this paper, we focus on mechanical energy harvesting using piezoelectric materials integrated into flexible substrates. Modeling of these devices is important for the evaluation of their transduction efficiency. Other than classical thin piezoelectric layers, a composite layer using piezoelectric nanostructures is considered in order to evaluate its performance in a bending configuration.
Keywords
energy harvesting; flexible electronics; low-power electronics; piezoelectric materials; piezoelectric transducers; autonomous integrated systems; bending configuration; composite layer; flexible substrates; low power circuits; material integration; mechanical energy harvesting; multiphysics modeling; piezoelectric materials; piezoelectric nanostructures; thin piezoelectric layers; thin piezoelectric transducers; transduction efficiency; Electric potential; Electrodes; Energy harvesting; Materials; Nanowires; Strain; Zinc oxide; flexible devices; mechanical energy harvesting; nanowires; piezoelectricity; transducer;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultimate Integration on Silicon (ULIS), 2014 15th International Conference on
Conference_Location
Stockholm
Type
conf
DOI
10.1109/ULIS.2014.6813910
Filename
6813910
Link To Document