• DocumentCode
    138294
  • Title

    Fabrication and thermoelectric characterization of GeSn nanowires

  • Author

    Noroozi, M. ; Hamawandi, B. ; Toprak, M.S. ; Radamson, H.H.

  • Author_Institution
    Dept. of Mater. & Nano Phys., KTH R. Inst. of Technol., Kista, Sweden
  • fYear
    2014
  • fDate
    7-9 April 2014
  • Firstpage
    125
  • Lastpage
    128
  • Abstract
    In this study, GeSn nanowires (NWs) were fabricated and the thermoelectric performance in terms of power factor and contact resistance have been investigated and compared to Ge and Si. The ohmic contact to the NWs was made by Pt/Ti whereas low contact resistance was obtained by Ni-GeSn (or Ni-Ge) layers. A detailed investigation was performed to process towards low resistance Ni-GeSn phase for GeSn NWs. The phase formation of Ni-GeSn layers was examined by x-ray diffraction (XRD) and the residual strain in GeSn beneath the Ni-GeSn was also measured by high resolution reciprocal lattice mapping (HRRLM). It was demonstrated that Ni reaction with GeSn layer resulted in strain reduction in the remained GeSn material due to Ni outdiffusion to the GeSn NWs demonstrated higher Seebeck coefficient compared to Ge and Si NWs, which suggest promising thermoelectric properties in GeSn.
  • Keywords
    Seebeck effect; X-ray diffraction; chemical interdiffusion; contact resistance; germanium compounds; interface structure; internal stresses; nanofabrication; nanowires; nickel; ohmic contacts; platinum; semiconductor growth; semiconductor materials; semiconductor-metal boundaries; thermoelectric power; titanium; Ni-GeSn; Pt-Ti-GeSn; Seebeck coefficient; X-ray diffraction; XRD; contact resistance; high resolution reciprocal lattice mapping; nanowires; ohmic contact; out-diffusion; phase formation; power factor; residual strain; strain reduction; thermoelectricity; Conductivity; Nanowires; Silicon; Temperature measurement; Tin; GeSn nanowires; Ni-GeSn; contact resistance; themoelectric;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultimate Integration on Silicon (ULIS), 2014 15th International Conference on
  • Conference_Location
    Stockholm
  • Type

    conf

  • DOI
    10.1109/ULIS.2014.6813914
  • Filename
    6813914