77-GHz-band surface mountable ceramic package

Author

Kitazawa, Kenji ; Koriyama, Shinichi ; Minamiue, Hidehiro ; Fujii, Mikio

Author_Institution

R&D Centre, Kyocera Corp., Kagoshima, Japan

Volume

48

Issue

9

fYear

2000

fDate

9/1/2000 12:00:00 AM

Firstpage

1488

Lastpage

1491

Abstract

The authors have developed a surface mount-type ceramic package for 77-GHz millimeter-wave application. The package has a new terminal structure for surface mount and a feedthrough of electromagnetic coupling. The authors have adopted a coplanar structure for the surface mount terminal. The structure for the electromagnetic coupling consists of microstrip line/slot/microstrip line (MSL/SLOT/MSL). Total transmission loss between the signal line on board and the RF input-output terminal inside the package was 1.0 dB at 77 GHz Standard deviation of the insertion loss was 0.08 dB (n = 57) The authors have confirmed that the surface mountable package shows high transmission characteristics as well as high reliability

Keywords

MIMIC; ceramic packaging; integrated circuit packaging; integrated circuit reliability; losses; microstrip lines; slot lines; surface mount technology; 1.0 dB; 77 GHz; RF input-output terminal; coplanar structure; electromagnetic coupling feedthrough; insertion loss; microstrip line/slot/microstrip line; millimeter-wave application; reliability; surface mountable ceramic package; terminal structure; transmission characteristics; transmission loss; Ceramics; Costs; Electromagnetic coupling; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit reliability; MMICs; Microstrip; Millimeter wave radar; Propagation losses;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.868999

Filename

868999