DocumentCode
1383129
Title
High performance of silicided silicon-sidewall source and drain (S 4D) structure
Author
Yoshitomi, Takashi ; Saito, Masanobu ; Ohguro, Tatsuya ; One, M. ; Momose, Hisayo Sasaki ; Morifuji, Eiji ; Morimoto, Toyota ; Katsumata, Yasuhiro ; Iwai, Hiroshi
Author_Institution
Microelectron. Eng. Lab., Toshiba Corp., Kawasaki, Japan
Volume
45
Issue
6
fYear
1998
fDate
6/1/1998 12:00:00 AM
Firstpage
1295
Lastpage
1299
Abstract
A silicided silicon-sidewall source and drain (S4D) structure is proposed for sub-0.1-μm devices. The merit of the S4D structure is that the series resistance of the source and drain is significantly reduced since the silicide layer is attached very close to the gate electrode and the silicon sidewall can be doped very highly. Thus, very high drain current drive can be expected, Another advantage of this structure is that the source and drain extensions are produced by the solid-phase diffusion of boron from the highly doped silicon-sidewall. Thus, shallow extensions with very high doping can be realized. A 75-nm gate length pMOSFET fabricated with this structure is shown to exhibit excellent electrical characteristics
Keywords
MOSFET; diffusion; electric resistance; elemental semiconductors; silicon; 75 nm; S4D structure; Si; drain current drive; electrical characteristics; gate electrode; pMOSFET; series resistance; shallow extensions; silicided silicon-sidewall source and drain structure; solid-phase diffusion; Boron; Doping; Electrodes; Etching; Fabrication; Impurities; MOSFET circuits; Silicidation; Silicides; Silicon;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.678549
Filename
678549
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