• DocumentCode
    1383129
  • Title

    High performance of silicided silicon-sidewall source and drain (S 4D) structure

  • Author

    Yoshitomi, Takashi ; Saito, Masanobu ; Ohguro, Tatsuya ; One, M. ; Momose, Hisayo Sasaki ; Morifuji, Eiji ; Morimoto, Toyota ; Katsumata, Yasuhiro ; Iwai, Hiroshi

  • Author_Institution
    Microelectron. Eng. Lab., Toshiba Corp., Kawasaki, Japan
  • Volume
    45
  • Issue
    6
  • fYear
    1998
  • fDate
    6/1/1998 12:00:00 AM
  • Firstpage
    1295
  • Lastpage
    1299
  • Abstract
    A silicided silicon-sidewall source and drain (S4D) structure is proposed for sub-0.1-μm devices. The merit of the S4D structure is that the series resistance of the source and drain is significantly reduced since the silicide layer is attached very close to the gate electrode and the silicon sidewall can be doped very highly. Thus, very high drain current drive can be expected, Another advantage of this structure is that the source and drain extensions are produced by the solid-phase diffusion of boron from the highly doped silicon-sidewall. Thus, shallow extensions with very high doping can be realized. A 75-nm gate length pMOSFET fabricated with this structure is shown to exhibit excellent electrical characteristics
  • Keywords
    MOSFET; diffusion; electric resistance; elemental semiconductors; silicon; 75 nm; S4D structure; Si; drain current drive; electrical characteristics; gate electrode; pMOSFET; series resistance; shallow extensions; silicided silicon-sidewall source and drain structure; solid-phase diffusion; Boron; Doping; Electrodes; Etching; Fabrication; Impurities; MOSFET circuits; Silicidation; Silicides; Silicon;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.678549
  • Filename
    678549