• DocumentCode
    1383532
  • Title

    Special issue on materials, processing and reliability of 3D interconnects

  • Volume
    57
  • Issue
    12
  • fYear
    2010
  • Firstpage
    3548
  • Lastpage
    3548
  • Abstract
    Provides notice of upcoming special issue(s) of interest to practitioners and researchers.
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2010.2090593
  • Filename
    5640537
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1383532