DocumentCode
1384712
Title
The evaluation of fast-flow, fast-cure underfills for flip chip on organic substrate
Author
Wun, Kai-Lam Bill ; Margaritis, George
Author_Institution
Electron. Assembly Dev. Center, Hewlett-Packard Co., Palo Alto, CA, USA
Volume
21
Issue
1
fYear
1998
fDate
3/1/1998 12:00:00 AM
Firstpage
13
Lastpage
17
Abstract
Seven underfill formulations have been evaluated for fast-cure, fast-flow, and low-clearance flow applications in flip chip assemblies. The effect of different underfill ingredients on processing and reliability is discussed. It will be shown that at least one formulation has superior flow rate under a 30-μm die than any currently available commercial underfill
Keywords
encapsulation; flip-chip devices; integrated circuit packaging; integrated circuit reliability; 30 micron; fast-cure underfills; flip chip; low-clearance flow applications; organic substrate; reliability; Additives; Assembly; Curing; Epoxy resins; Flip chip; Glass; Moisture; Packaging; Temperature; Thermal expansion;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher
ieee
ISSN
1070-9886
Type
jour
DOI
10.1109/95.679026
Filename
679026
Link To Document