Title :
Measuring equipment and measurements of adhesive force between gold electrical contacts
Author :
Kobayashi, Atsuto ; Takano, Satoshi ; Kubono, Takayoshi
Author_Institution :
Takamisawa Electr. Co. Ltd., Sakushi, Japan
fDate :
3/1/1998 12:00:00 AM
Abstract :
This paper describes the apparatus to measure adhesive force between electrical contacts with micro-sliding and the measurements of adhesive force between gold electrical contacts by this measuring equipment. The electrical contact that is concerned in this paper is mounted on a cantilever supporting arm in a small electromagnetic relay. A straight back-and-forth sliding motion occurs on closed contacts when a relay suffers from an externally applied shock, or on contact follow of closing contact operation. Therefore, this apparatus is designed to give a straight back-and-forth sliding motion to closed electrical contacts. We investigated the measuring accuracy of this apparatus and measured the adhesive force between gold electrical contacts. The following results have been confirmed: 1) The error in determination of contact force from 19.6×10-3-1.47 N is less than 1%, 2) The error in measurement of adhesive force from 9.8×10-3-1.47 N is less than 1%, 3) At gold contacts under conditions of contact force (0.1-0.5 N), and the number 1-20 cycles and the amplitude (50 and 100 μm) of straight back-and-forth sliding motion, the adhesive force measured by this apparatus has been illustrated to be influenced by the contact force, and the number and the amplitude of sliding motion
Keywords :
adhesion; electrical contacts; gold; relays; sliding friction; Au; adhesive force; cantilever supporting arm; electrical contacts; electromagnetic relay; externally applied shock; measuring accuracy; micro-sliding; sliding motion; Adhesives; Bonding forces; Contacts; Electric variables measurement; Electromagnetic forces; Electromagnetic measurements; Force measurement; Gold; Pollution measurement; Relays;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on