On the positive temperature dependence of the thermal conductivity of a diamond-based heat sink paste

Author

Hasselman, D.P.H. ; Donaldson, Kimberly Y.

Author_Institution

Thermophys. Res. Lab., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA

Volume

21

Issue

1

fYear

1998

fDate

3/1/1998 12:00:00 AM

Firstpage

124

Lastpage

126

Abstract

The strongly positive temperature dependence of literature thermal conductivity data for n-decane/diamond pastes is suggested to be largely due to the corresponding strongly positive temperature dependence of the finite interfacial thermal conductance resulting from phonon scattering at the n-decane/diamond interface. It is suggested that increases in the diamond particle size will create corresponding increases in the thermal conductivity, coupled with a decrease in the positive temperature dependence

Keywords

diamond; heat sinks; packaging; thermal conductivity; C; diamond-based heat sink paste; finite interfacial thermal conductance; packaging; phonon scattering; positive temperature dependence; thermal conductivity; Electronic packaging thermal management; Electronics packaging; Equations; Frequency; Heat sinks; Heat transfer; Materials science and technology; Temperature dependence; Temperature distribution; Thermal conductivity;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.679041

Filename

679041