Title :
Efficient design using fuzzy logic based regression models
Author :
Schaible, Brian ; Lee, Yung-Chang ; Xie, Hong
Author_Institution :
Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA
fDate :
3/1/1998 12:00:00 AM
Abstract :
With ever decreasing design cycles, it is important for designers to have techniques they can use to quickly and efficiently model new designs. From these models, package performance can be estimated and electrical, thermal, and mechanical considerations can be balanced. In this paper, we present a method of quickly investigating new design concepts based on knowledge of previously studied designs and knowledge of the differences between the new and old designs. This approach is useful when the difference between designs is simple and can be accurately modeled with fewer data. The use of less data equates to a savings of time and money. In the case studies presented, we establish two “base” models using two data sets of 40 points each, then we establish two additional models of similar processes using only five and seven points each. Here, the initial (base) designs and the design differences are modeled with fuzzy logic based regression models. Such fuzzy logic based regression models can be based on numerically or empirically obtained data and/or qualitative knowledge of the system to be modeled. Once established, these models have the advantage of offering very fast response times uncharacteristic of experimentation, prototyping, and numerical methods such as finite element, finite difference, or boundary element modeling
Keywords :
design aids; design engineering; fuzzy logic; modelling; packaging; design cycles; electronic package design; fuzzy logic based regression models; package performance estimation; previous design knowledge; Analytical models; Delay; Electronic packaging thermal management; Finite difference methods; Finite element methods; Fuzzy logic; Fuzzy systems; Manufacturing; Mechanical engineering; Prototypes;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on