Title :
Analytical modeling of spreading resistance in flux tubes, half spaces, and compound disks
Author :
Yovanovich, M.M. ; Culham, J.R. ; Teertstra, Pete
Author_Institution :
Waterloo Univ., Ont., Canada
fDate :
3/1/1998 12:00:00 AM
Abstract :
A review of previously published models and solutions pertinent to the issue of modeling thermal resistances of diamond on copper heat sink systems is presented. The many particular solutions are shown to be special cases of the comprehensive model developed for a circular heat source in perfect thermal contact with the top surface of a compound disk which consists of two isotropic layers in perfect thermal contact. The bottom surface of the compound disk is subjected to a convective or contact cooling condition. Whenever possible simple models and correlation equations are presented for ease of computation. Bounds are presented for estimating the overall thermal resistance of several important cases
Keywords :
cooling; electric resistance; heat sinks; modelling; packaging; reviews; temperature distribution; thermal resistance; analytical modeling; circular heat source; compound disks; contact cooling condition; convective cooling condition; correlation equations; diamond on Cu heat sink systems; flux tubes; half spaces; review; spreading resistance; thermal resistances; Analytical models; Copper; Equations; Heat sinks; Immune system; Resistance heating; Space heating; Temperature; Thermal conductivity; Thermal resistance;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on