DocumentCode :
1385058
Title :
TDDB and Pulse-Breakdown Studies of Si-Rich  \\hbox {SiN}_{x} Antifuses and Antifuse-Based ROMs
Author :
Kaplar, Robert J. ; Habermehl, Scott D. ; Apodaca, Roger T. ; Havener, Brad ; Roherty-Osmun, Elizabeth
Author_Institution :
Microelectron. Dev. Lab., Sandia Nat. Labs., Albuquerque, NM, USA
Volume :
58
Issue :
1
fYear :
2011
Firstpage :
224
Lastpage :
228
Abstract :
Antifuses are electronic devices that can be irreversibly converted from a high-resistance state to a low-resistance state. Thus, they are ideal candidates for one-time-programmable many-times-readable nonvolatile memories. In this paper, the reliability and the programming characteristics of Si-rich SiNx, antifuses have been studied using time-dependent dielectric breakdown and pulse-breakdown measurements on both single-device test structures and full read-only memories. Contrary to measurements on thick films in which the Poole-Frenkel barrier lowering dominates breakdown, these measurements on fully processed and integrated antifuses indicate that a Fowler-Nordheim-like mechanism governs both programming and long-term reliability.
Keywords :
electric breakdown; elemental semiconductors; integrated circuit reliability; read-only storage; semiconductor thin films; silicon; silicon compounds; Fowler-Nordheim-like mechanism; Poole-Frenkel barrier lowering; Si-SiNx; TDDB; antifuse-based ROM; electronic devices; full read-only memories; high-resistance state; long-term reliability; low-resistance state; many-times-readable nonvolatile memories; one-time-programmable nonvolatile memories; pulse-breakdown measurements; pulse-breakdown study; single-device test structures; thick film measurements; time-dependent dielectric breakdown; Dielectric breakdown; Laboratories; Read only memory; Reliability; Silicon; Tunneling; Antifuse; dielectric breakdown; pulse testing; reliability; silicon nitride;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2010.2089057
Filename :
5641603
Link To Document :
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