• DocumentCode
    1385664
  • Title

    Interstitial redundancy: an area efficient fault tolerance scheme for large area VLSI processor arrays

  • Author

    Singh, Adit D.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
  • Volume
    37
  • Issue
    11
  • fYear
    1988
  • fDate
    11/1/1988 12:00:00 AM
  • Firstpage
    1398
  • Lastpage
    1410
  • Abstract
    In the proposed scheme, spare PEs are located at interstitial sites within the array. Each spare can functionally replace any one of the neighboring primary PEs that are connected to it. Because spares are physically close to the PE that they replace, restructured interconnections are short, minimizing performance degradation. This structure can incorporate different levels of redundancy depending on how many of the interstitial sites are used to locate spares, and also how many spares are placed at each site. The author gives a polynomial time algorithm for assigning operational spares to failed primary PEs. He also gives area efficient layouts for such structures, and designs for implementing the switching network needed for reconfiguration. A procedure for deciding the optimum level of redundancy so as to maximize chip area utilization is also shown. The main attractive features of interstitial redundancy are short (fixed length) PE interconnections and high utilization of failure-free PEs. The analysis shows that for a wide range of array sizes and PE survival probabilities, 45-55 percent utilization of failure-free PEs on the chip can be achieved
  • Keywords
    VLSI; cellular arrays; circuit layout; fault tolerant computing; redundancy; PE survival probabilities; area efficient fault tolerance scheme; area efficient layouts; chip area utilization; interstitial redundancy; interstitial sites; large area VLSI processor arrays; operational spares; performance degradation; polynomial time algorithm; reconfiguration; switching network; wafer scale integration; Circuit faults; Clocks; Degradation; Delay; Fault tolerance; Integrated circuit interconnections; Integrated circuit packaging; Logic arrays; Redundancy; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Computers, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9340
  • Type

    jour

  • DOI
    10.1109/12.8705
  • Filename
    8705