DocumentCode :
1386051
Title :
Si-micromachined coplanar waveguides for use in high-frequency circuits
Author :
Herrick, Katherine Juliet ; Schwarz, Thomas A. ; Katehi, Linda P B
Author_Institution :
Michigan Univ., Ann Arbor, MI, USA
Volume :
46
Issue :
6
fYear :
1998
fDate :
6/1/1998 12:00:00 AM
Firstpage :
762
Lastpage :
768
Abstract :
This paper describes the development and characterization of a new class of Si-micromachined lines and circuit components for operation between 2-110 GHz. In these lines, which are a finite-ground coplanar-waveguide (FGC) type, Si micromachining is used to remove the dielectric material from the aperture regions in an effort to reduce dispersion and minimize propagation loss. Measured results have shown a considerable loss reduction to levels that compare favorably with those of membrane lines and rectangular waveguides. Micromachined FGC lines have been used to develop V- and W-band bandpass filters. The W-band micromachined FGC filter has shown a 0.8-dB improvement in insertion loss at 94 GHz over a conventional FGC line. This approach offers an excellent alternative to the membrane technology, exhibiting very low loss, no dispersion, and mode-free operation without using membranes to support the interconnect structure
Keywords :
MIMIC; MMIC; band-pass filters; coplanar waveguides; dispersion (wave); elemental semiconductors; losses; microwave filters; millimetre wave filters; silicon; 2 to 110 GHz; Si; V-band; W-band; bandpass filters; dispersion; finite-ground coplanar-waveguide; high-frequency circuits; insertion loss; loss reduction; micromachined coplanar waveguides; mode-free operation; propagation loss; Apertures; Band pass filters; Biomembranes; Circuits; Coplanar waveguides; Dielectric loss measurement; Dielectric materials; Dielectric measurements; Micromachining; Propagation losses;
fLanguage :
English
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9480
Type :
jour
DOI :
10.1109/22.681198
Filename :
681198
Link To Document :
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