Title :
Development of a High-Lumen Solid State Down Light Application
Author :
Arik, Mehmet ; Sharma, Rajdeep ; Jackson, Jennifer ; Prabhakaran, Satish ; Seeley, Charles ; Utturkar, Yogen ; Weaver, Stan ; Kuenzler, Glenn ; Han, Bongtae
Author_Institution :
Thermal Syst. Lab., GE Global Res. Center, Niskayuna, NY, USA
Abstract :
Light-emitting diode (LED)-based solid-state lighting (SSL) products have been exceeding the predicted performances especially at the chip and package levels. This has led to new SSL-based products for energy savings and long lifetimes. Large amounts of government funding and private investments have been made during the last decade to accelerate and guide the technology. This paper focuses on the development of an LED-based high-lumen luminaire technology. The critical subcomponents of the luminaire are the LED light engine (LED chips and optical system), thermal management, and driver electronics. Each of these subcomponents will be discussed in detail for a 100 W incandescent replacement technology. The paper addresses system integration of each of the subcomponents. While the design of new products evolve, the lack of reliability data poses a risk of premature failure of LED-based products. Premature failures would trigger customer rejection and may delay market penetration. Therefore, luminaire reliability is an important aspect of luminaire design. In cohort with this notion, finally, the luminaire reliability has been discussed.
Keywords :
LED lamps; driver circuits; reliability; thermal management (packaging); LED light engine; customer rejection; driver electronics; energy savings; high-lumen luminaire technology; incandescent replacement technology; light emitting diode; luminaire reliability; power 100 W; premature failures; solid state lighting; thermal management; Light emitting diodes; Lighting; Reliability; Solid state lighting; Thermal management; Driver electronics; lamp; light engine; light-emitting diodes (LEDs); luminaire; reliability; solid-state lighting (SSL); synthetic jets; system integration; thermal management;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2010.2055565