• DocumentCode
    1386349
  • Title

    Miniature Vapor Compressor Refrigeration System for Electronic Cooling

  • Author

    Chang, Chih-Chung ; Liang, Nai-Wen ; Chen, Sih-Li

  • Author_Institution
    Dept. of Mech. Eng., Nat. Taiwan Univ., Taipei, Taiwan
  • Volume
    33
  • Issue
    4
  • fYear
    2010
  • Firstpage
    794
  • Lastpage
    800
  • Abstract
    This paper experimentally investigated the thermal performance of a miniature vapor compressor refrigeration system using a thermal resistance model for electronic cooling. The evaporator, compressor, expansion valve, and condenser are the four main devices forming the refrigeration system with R-134a as a working fluid. The experimental parameters considered were the openings of the expansion valve and input heating power. The results indicated that the system in this paper had the largest cooling capacity of 150 W and coefficient of performance of 4.25 at the 8th and 9th openings of the expansion valve, respectively. The results also showed that correlations of the thermal resistance of the evaporator and the condenser are developed with experimental data and their precision, compared with the experimental data, was about 4.42% and 12%, respectively. Besides the adjustment of the compressor speed could decrease the possibility of the occurrence of condensation phenomena near the inlet and outlet of the evaporator. Also, the smallest dimension of the combination of the evaporator and condenser is presented at the input heating power of 150 W and the 8th opening of the expansion valve.
  • Keywords
    compressors; condensation; refrigeration; thermal resistance; compressor speed; condensation phenomena; condenser; electronic cooling; expansion valve; input heating power; miniature vapor compressor refrigeration; power 150 W; thermal resistance; Electronics cooling; Heat transfer; Refrigerants; Resistance heating; Thermal resistance; Valves; Condensation phenomena; miniature vapor compressor refrigeration; thermal resistance;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2010.2070800
  • Filename
    5643113