• DocumentCode
    1387286
  • Title

    Ion beam sputtering of magnetoresistive multilayers: Co/Cu and Co-modified Ni81Fe19/Cu systems

  • Author

    Schmeusser, S. ; Hubert, Alex ; Rupp, Gunter

  • Author_Institution
    Inst. fur Werkstoffwissenschaften, Erlangen-Nurnberg Univ., Germany
  • Volume
    32
  • Issue
    5
  • fYear
    1996
  • fDate
    9/1/1996 12:00:00 AM
  • Firstpage
    4722
  • Lastpage
    4724
  • Abstract
    The ion beam sputtering method was applied to the preparation of Co/Cu and related multilayers. Improvements were obtained by changing the sputtering gas from Ar to Xe and by increasing the growth rate. By these means we achieved a magnetoresistance effect of 51% at room temperature in Co/Cu multilayers of only 16 periods. With these optimized working conditions Ni81Fe19/Cu multilayers with cobalt interfaces of various thicknesses were prepared. A linear correlation between the magnetoresistance ratio and the antiferromagnetically coupled volume fraction is found indicating a predominant interface contribution to the magnetoresistance effect. On the other hand, cobalt was found to degrade the coupling quality and to enhance the coercivity
  • Keywords
    cobalt; coercive force; copper; ferromagnetic materials; giant magnetoresistance; iron alloys; magnetic multilayers; nickel alloys; sputter deposition; 20 C; Ar; Co-Cu; Co-modified Ni81Fe19/Cu systems; Co/Cu; Cu-Co-Ni81Fe19; Ni81Fe19/Cu multilayers; Xe; antiferromagnetically coupled volume fraction; coercivity; coupling quality; growth rate; interface contribution; ion beam sputtering; ion beam sputtering method; linear correlation; magnetoresistance effect; magnetoresistance ratio; magnetoresistive multilayers; multilayers; preparation; room temperature; sputtering gas; Antiferromagnetic materials; Argon; Cobalt; Employee welfare; Ion beams; Iron; Magnetic multilayers; Magnetoresistance; Sputtering; Temperature;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.539130
  • Filename
    539130