Title :
Design, Simulation, and Fabrication of a Hybrid Excitation Compulsator
Author :
Cui, Shumei ; Wu, Shaopeng ; Zhang, Jing
Author_Institution :
Dept. of Electr. Eng., Harbin Inst. of Technol., Harbin, China
Abstract :
We present the detailed design, simulation, and fabrication of a hybrid excitation passive compensated pulsed alternator (HEPCPA). The HEPCPA design offers long-lifetime stable operation over a broad range of operating conditions. The stator uses a two-winding design. A slotless armature winding is epoxy bonded on the inner ring of the stator core, and the electrical-excitation winding is embedded in the middle slot of the stator core. The second electrical-excitation winding is used to expand the acceptable range of operating conditions. We explore the magnetic flux density distributions under permanent-magnetic excitation. In addition, we examine two types of electrical excitation. We then calculate the eddy current density distribution in the compensation shield. We discuss conditions for the safe operation of the permanent magnet. We present fabrication techniques for the slotless armature winding. We discuss our experimental results showing enhanced magnetic and electrical field activity. The experimental results show agreement with the simulation.
Keywords :
eddy currents; magnetic flux; permanent magnets; pulsed power supplies; HEPCPA design; eddy current density distribution; electrical-excitation winding; enhanced electrical field activity; enhanced magnetic field activity; excitation compulsator design; excitation compulsator fabrication; excitation compulsator simulation; hybrid excitation passive compensated pulsed alternator; magnetic flux density distributions; permanent-magnetic excitation; slotless armature winding; stator core; two-winding design; Magnetic circuits; Magnetic noise; Magnetic separation; Magnetic shielding; Permanent magnets; Rotors; Windings; Compulsator; hybrid excitation; passive compensation; permanent-magnet demagnetization;
Journal_Title :
Plasma Science, IEEE Transactions on
DOI :
10.1109/TPS.2010.2087418