• DocumentCode
    1388883
  • Title

    Radio-Optical Dual-Mode Communication Modules Integrated With Planar Antennas

  • Author

    Boryssenko, Anatoliy O. ; Liao, Jun ; Zeng, Juan ; Deng, Shengling ; Joyner, Valencia M. ; Huang, Z. Rena

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Massachusetts, Amherst, MA, USA
  • Volume
    58
  • Issue
    2
  • fYear
    2010
  • Firstpage
    403
  • Lastpage
    410
  • Abstract
    This paper presents new results on integrated devices for radio and free-space optical dual-mode communication. Two novel hybrid packaging schemes using two different microwave printed antenna designs are presented for the integration of radio-optical front-end circuits on a planar compact printed circuit board with shared electrical and structural components. Full-wave electromagnetic (EM) simulations are presented for antenna optimization to minimize EM interference between the radio and optical circuits. A hybrid radio-optical package design is developed, prototyped, and experimentally studied using a modified quasi-Yagi antenna with split directors to form pads for opto-electronic device integration. Dual-mode link connectivity is investigated in simulations and experiments. A data rate of 2.5 Gb/s is demonstrated for the optical channel despite 15-20-dB signal coupling between the optical and microwave circuits.
  • Keywords
    Yagi antenna arrays; electromagnetic interference; optical communication; optical links; planar antennas; printed circuits; radiocommunication; EM interference; antenna optimization; dual-mode link connectivity; electrical components; free-space optical dual-mode communication; full-wave electromagnetic simulation; hybrid packaging scheme; integrated devices; microwave circuit; microwave printed antenna design; modified quasiYagi antenna; optical circuit; optoelectronic device integration; planar antenna; printed circuit board; radio communication; radio-optical dual-mode communication; radio-optical front-end circuits; radio-optical package design; structural components; Antenna; dual-mode wireless communication; integration; optical receiver; optical transmitter; packaging designs;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/TMTT.2009.2038441
  • Filename
    5393019