DocumentCode :
1388883
Title :
Radio-Optical Dual-Mode Communication Modules Integrated With Planar Antennas
Author :
Boryssenko, Anatoliy O. ; Liao, Jun ; Zeng, Juan ; Deng, Shengling ; Joyner, Valencia M. ; Huang, Z. Rena
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Massachusetts, Amherst, MA, USA
Volume :
58
Issue :
2
fYear :
2010
Firstpage :
403
Lastpage :
410
Abstract :
This paper presents new results on integrated devices for radio and free-space optical dual-mode communication. Two novel hybrid packaging schemes using two different microwave printed antenna designs are presented for the integration of radio-optical front-end circuits on a planar compact printed circuit board with shared electrical and structural components. Full-wave electromagnetic (EM) simulations are presented for antenna optimization to minimize EM interference between the radio and optical circuits. A hybrid radio-optical package design is developed, prototyped, and experimentally studied using a modified quasi-Yagi antenna with split directors to form pads for opto-electronic device integration. Dual-mode link connectivity is investigated in simulations and experiments. A data rate of 2.5 Gb/s is demonstrated for the optical channel despite 15-20-dB signal coupling between the optical and microwave circuits.
Keywords :
Yagi antenna arrays; electromagnetic interference; optical communication; optical links; planar antennas; printed circuits; radiocommunication; EM interference; antenna optimization; dual-mode link connectivity; electrical components; free-space optical dual-mode communication; full-wave electromagnetic simulation; hybrid packaging scheme; integrated devices; microwave circuit; microwave printed antenna design; modified quasiYagi antenna; optical circuit; optoelectronic device integration; planar antenna; printed circuit board; radio communication; radio-optical dual-mode communication; radio-optical front-end circuits; radio-optical package design; structural components; Antenna; dual-mode wireless communication; integration; optical receiver; optical transmitter; packaging designs;
fLanguage :
English
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9480
Type :
jour
DOI :
10.1109/TMTT.2009.2038441
Filename :
5393019
Link To Document :
بازگشت