Title :
Modeling of Charge-Trapping/Detrapping-Induced Voltage Instability in High-
Gate Dielectrics
Author :
Sahhaf, Sahar ; De Brabanter, Kris ; Degraeve, Robin ; Suykens, Johan A K ; De Moor, Bart ; Groeseneken, Guido
Author_Institution :
IMEC, Leuven, Belgium
fDate :
3/1/2012 12:00:00 AM
Abstract :
Investigation of trapping-/detrapping-induced volt- age instabilities does demand not only accurate measurements but also a precise methodology for extracting the exact magnitude of the voltage shifts in the hysteresis curves which is indispensable. Particularly, in dc measurements where the induced voltage shifts are small, an excellent accuracy of the analysis method is required. Therefore, in this paper, we develop a new methodology that, with excellent agreement, models the complete measured Id-Vg hysteresis curves using least squares support vector machines. Furthermore, we apply this model and formulate an optimization problem resulting in the maximum trap-induced voltage shifts in the entire hysteresis curves. Also, for the first time, we quantify the induced error on these extracted maxima. Finally, we illustrate the applicability of the introduced methodology by profiling the initially present and stress-induced defects in a 1-nm SiO2/3-nm HfSiO dielectric stack.
Keywords :
hafnium compounds; high-k dielectric thin films; least squares approximations; materials science computing; silicon compounds; support vector machines; DC measurements; I-V hysteresis curves; SiO2-HfSiO; charge-trapping-detrapping-induced voltage instability model; high-gate dielectrics; least squares support vector machines; maximum trap-induced voltage shifts; optimization problem; size 1 nm; size 3 nm; stress-induced defects; voltage shift magnitude extraction; Accuracy; Data models; Hysteresis; Logic gates; Optimization; Support vector machines; Voltage measurement; Hf-based dielectric; maximum voltage shift; oxide defects; trapping- and detrapping-induced voltage instability;
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2011.2178073