DocumentCode
1389281
Title
Multisite microprobes for neural recordings
Author
Blum, Norman A. ; Carkhuff, Bliss G. ; Charles, Harry K., Jr. ; Edwards, Richard L. ; Meyer, Richard A.
Author_Institution
Appl. Phys. Lab., Johns Hopkins Univ., Laurel, MD, USA
Volume
38
Issue
1
fYear
1991
Firstpage
68
Lastpage
74
Abstract
Multisite, passive microprobes have been developed to allow simultaneous recording of action potential activity from multiple neurons at different locations in the brain. The microprobes were fabricated using standard integrated-circuit techniques. The probe is a planar structure that consists of gold electrodes sandwiched between two polyimide dielectric layers and bonded to a molybdenum structural support. Windows in the top dielectric layer expose the electrode sites and bonding pads. In two distinct versions of the probe, four or six recording sites of approximately 25 mu m 2 are arranged on a dagger-shaped structure which can penetrate the pia. The bonding pads and interconnect wires at the probe head are entirely encapsulated in a tubular fixture that is packed with silicone RTV and sealed with epoxy to protect the interconnections from contact with body fluids. The site impedances at 1 kHz are typically between 2 and 4 M Omega . Probe lifetimes for continuous immersion in physiological saline solution, as measured by impedance, have exceeded 750 h. The failure mechanism is believed to be due to moisture and ion absorption in the top dielectric layer.
Keywords
biological techniques and instruments; neurophysiology; probes; 1 kHz; 2 to 4 Mohm; action potential activity; acute neurophysiological experiments; integrated-circuit techniques; multisite microprobes; neural recordings; pia; polyimide dielectric layers; simultaneous recording; site impedance; tubular fixture; Bonding; Dielectrics; Electrodes; Gold; Impedance; Magnetic heads; Neurons; Polyimides; Probes; Wires; Action Potentials; Calibration; Electric Conductivity; Electrodes; Equipment Design; Neurophysiology;
fLanguage
English
Journal_Title
Biomedical Engineering, IEEE Transactions on
Publisher
ieee
ISSN
0018-9294
Type
jour
DOI
10.1109/10.68211
Filename
68211
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