DocumentCode
1389458
Title
Characteristics including electron velocity overshoot for 0.1-μm-gate-length GaAs SAINT MESFET´s
Author
Enoki, Takatomo ; Sugitani, Suehiro ; Yamane, Yasuro
Author_Institution
NTT, Kanagawa, Japan
Volume
37
Issue
4
fYear
1990
fDate
4/1/1990 12:00:00 AM
Firstpage
935
Lastpage
941
Abstract
Short-channel effects, substrate leakage current, and average electron velocity are investigated for 0.1-μm-gate-length GaAs MESFETs fabricated using the SAINT (self-aligned implantation for n+-layer technology) process. The threshold-voltage shift was scaled by the aspect ratio of the channel thickness to the gate length ( a /L g). The substrate leakage current in a sub-quarter-micrometer MESFET is completely suppressed by the buried p layers and shallow n+-layers. The average electron velocity for 0.1- to 0.2-μm-gate-length FETs is estimated to be 3×106 cm/s from the analysis of intrinsic FET parameters. This high value indicates electron velocity overshoot. Moreover, a very high f T of 93.1 GHz has been attained by the 0.1-μm SAINT MESFET
Keywords
III-V semiconductors; Schottky gate field effect transistors; carrier mobility; gallium arsenide; leakage currents; solid-state microwave devices; 0.1 micron; 93.1 GHz; GaAs; MESFET; SAINT; aspect ratio; average electron velocity; channel thickness; cutoff frequency; electron velocity overshoot; gate length; intrinsic FET parameters; n+-layer technology; self-aligned implantation; short channel effects; substrate leakage current; threshold-voltage shift; Electrons; FETs; Gallium arsenide; Helium; Ion implantation; Leakage current; MESFETs; Rapid thermal annealing; Reproducibility of results; Resists;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.52426
Filename
52426
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