Title :
High collection efficiency CVD diamond alpha detectors
Author :
Bergonzo, P. ; Foulon, F. ; Marshall, R.D. ; Jany, C. ; Brambilla, A. ; McKeag, R.D. ; Jackman, R.B.
Author_Institution :
CEA, Centre d´´Etudes Nucleaires de Saclay, Gif-sur-Yvette, France
fDate :
6/1/1998 12:00:00 AM
Abstract :
Advances in Chemical Vapour Deposited (CVD) diamond have enabled the routine use of this material for sensor device fabrication, allowing exploitation of its unique combination of physical properties (low temperature susceptibility (>500°C), high resistance to radiation damage (>100 Mrad) and to corrosive media). A consequence of CVD diamond growth on silicon is the formation of polycrystalline films which has a profound influence on the physical and electronic properties with respect to those measured on monocrystalline diamond. We report the optimisation of physical and geometrical device parameters for radiation detection in the counting mode. Sandwich and co-planar electrode geometries are tested and their performances evaluated with regard to the nature of the field profile and drift distances inherent in such devices. The carrier drift length before trapping was measured under alpha particles and values as high as 40% of the overall film thickness are reported. Further, by optimising the device geometry, we show that a gain in collection efficiency, defined as the induced charge divided by the deposited charge within the material, can be achieved even though lower bias values are used
Keywords :
chemical vapour deposition; diamond; semiconductor counters; C; CVD; bias; carrier drift length; chemical vapour deposition; co-planar electrode geometries; collection efficiency; counting mode; device parameters; diamond alpha detectors; drift distance; field profile; induced charge; polycrystalline films; sandwich; Chemical sensors; Chemical vapor deposition; Electrical resistance measurement; Electrodes; Fabrication; Geometry; Radiation detectors; Semiconductor films; Silicon; Temperature sensors;
Journal_Title :
Nuclear Science, IEEE Transactions on