Electronic packaging in the 1990s: the perspective from Europe

Author

Wessely, Hermann ; Fritz, Otmar ; Horn, Michael ; Klimke, Peter ; Koschnick, Walter ; Schmidt, Karl-Heinz

Author_Institution

Siemens Nixdorf Informationssyst. AG, Munchen, Germany

Volume

14

Issue

2

fYear

1991

fDate

6/1/1991 12:00:00 AM

Firstpage

272

Lastpage

284

Abstract

Electronics packaging and interconnection technologies for mainframe computers are reviewed and predictions about the development of packaging systems beyond 1995 are made. Types of packages, their assembly, wiring board technology, microwiring substrates, polyimide-copper substrates, thin-film technologies, multilayer ceramic technology, printed circuit boards, cooling technology, packaging systems, and European activities are reviewed. These include the RISH project, ESPRIT program, the national microelectronics program (NMP), the APACHIP project, the JESSI program, and the packaging project

Keywords

mainframes; packaging; printed circuits; APACHIP project; ESPRIT program; JESSI program; RISH project; assembly; cooling technology; electronics packaging; interconnection technologies; mainframe computers; microwiring substrates; multilayer ceramic technology; packaging systems; printed circuit boards; thin-film technologies; wiring board technology; Assembly systems; Ceramics; Electronics packaging; Europe; Integrated circuit interconnections; Nonhomogeneous media; Printed circuits; Substrates; Thin film circuits; Wiring;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.87305

Filename

87305