• DocumentCode
    139105
  • Title

    System characterization of a novel haptic interface for natural orifice translumenal endoscopic surgery simulation

  • Author

    Dargar, Saurabh ; Sankaranarayanan, Ganesh ; De, Suvranu

  • Author_Institution
    Biomed. Eng. Dept., Rensselaer Polytech. Inst. in Troy, Troy, NY, USA
  • fYear
    2014
  • fDate
    26-30 Aug. 2014
  • Firstpage
    375
  • Lastpage
    379
  • Abstract
    Natural orifice translumenal endoscopic surgery (NOTES) is a minimally invasive procedure, which utilizes the body´s natural orifices to gain access to the peritoneal cavity. The VTEST© is a virtual reality NOTES simulator developed at the CeMSIM at RPI to train surgeons in NOTES. A novel 2 DOF decoupled haptic device was designed and built for this simulator. The haptic device can render 5.62 N and 190.05 N-mm of continuous force and torque respectively. In this work we have evaluated the haptic interface and developed a model to accurately describe the system behavior, to further incorporate into an impedance type controller for realistic haptic rendering in the VTEST©.
  • Keywords
    biomedical education; computer based training; continuing professional development; educational aids; endoscopes; haptic interfaces; medical control systems; rendering (computer graphics); surgery; teaching; virtual reality; 2 DOF decoupled haptic device design; CeMSIM; NOTES training; RPI; VTEST; continuous force; continuous torque; haptic interface model; haptic interface system characterization; impedance type controller; minimally invasive procedure; natural body orifices; natural orifice translumenal endoscopic surgery simulation; peritoneal cavity access; realistic haptic rendering; surgeon training; virtual reality NOTES simulator; Endoscopes; Force; Force feedback; Orifices; Surgery; Torque;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
  • Conference_Location
    Chicago, IL
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2014.6943607
  • Filename
    6943607