• DocumentCode
    1391084
  • Title

    Research concerning the separation and recovery of used printed wiring board solder

  • Author

    Yamagiwa, Yasuyuki ; Soyama, Shinichi ; Iwata, Shuichi

  • Author_Institution
    Sony Corp., Tokyo, Japan
  • Volume
    23
  • Issue
    3
  • fYear
    2000
  • fDate
    7/1/2000 12:00:00 AM
  • Firstpage
    214
  • Lastpage
    218
  • Abstract
    In recent years, with industries becoming more concerned about environmental problems, there has been a noticeable move toward regulating the use of lead in Europe and other regions. In line with this, there has been an increase in research concerning lead-free solder and its use as a substitute for regular solder. However, even if lead-free solder is used in newly developed products, products already on the market will still incorporate regular solder. This paper reports the results of tests using experimental equipment to verify a method of separating and recovering solder from the printed wiring boards (PWBs) of products to be scrapped
  • Keywords
    lead alloys; printed circuits; recycling; soldering; Pb-based solders; printed wiring board solder; recycling; scrapped products; solder recovery; solder separation; used PWB solder; Consumer electronics; Environmental factors; Environmentally friendly manufacturing techniques; Europe; Home appliances; Joining processes; Lead; Refrigerators; Testing; Wiring;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/6104.873250
  • Filename
    873250