Title :
MIM Capacitors With Crystalline-
Stack Featuring High Capacitance Density and Low Voltage Coefficient
Author :
Wu, Yung-Hsien ; Ou, Wei-Yuan ; Lin, Chia-Chun ; Wu, Jia-Rong ; Wu, Min-Lin ; Chen, Lun-Lun
Author_Institution :
Dept. of Eng. & Syst. Sci., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Abstract :
Metal-insulator-metal (MIM) capacitors with crystalline-TiO2/SiO2 stacked dielectric are explored in this letter. The crystalline TiO2 possesses a high permittivity while the SiO2 provides a negative quadratic voltage coefficient of capacitance (VCC-α) to cancel out the positive VCC-α from the crystalline TiO2. These desirable properties render MIM capacitors with high performance in terms of a capacitance density of 11.9 fF/μm2 with a VCC-α of 90 ppm/V2. With additional N2 plasma treatment on the crystalline TiO2, because of the effective passivation of grain-boundary-related defects and, consequently, a lower leakage current by a factor of 50, the VCC-α can be further lowered to 30 ppm/V2 with slight degradation in capacitance density to 11.2 fF/μm2, which well meets the requirement in 2018 set by ITRS.
Keywords :
MIM devices; capacitors; grain boundaries; leakage currents; passivation; permittivity; plasma materials processing; silicon compounds; titanium compounds; MIM capacitors; TiO2-SiO2; VCC-α; grain-boundary-related defects; high capacitance density; low voltage coefficient; metal-insulator-metal capacitors; negative quadratic voltage coefficient of capacitance; permittivity; plasma treatment; stacked dielectric; Capacitance; Capacitors; Electron devices; Leakage current; MIM capacitors; Plasmas; Conduction mechanism; crystalline-$ hbox{TiO}_{2}/hbox{SiO}_{2}$ stack; leakage current; metal–insulator–metal (MIM) capacitors; quadratic voltage coefficient of capacitance ( $VCChbox{-}alpha$);
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2011.2173791