• DocumentCode
    139148
  • Title

    Different layer thickness influences of a 50MHz intravascular ultrasound transducer

  • Author

    Li Zhangjian ; Shao Weiwei ; Xiang Yongjia ; Han Zhile ; Cui Yaoyao

  • Author_Institution
    Suzhou Inst. of Biomed. Eng. & Technol., Suzhou, China
  • fYear
    2014
  • fDate
    26-30 Aug. 2014
  • Firstpage
    542
  • Lastpage
    545
  • Abstract
    In order to design a 50MHz intravascular ultrasound (IVUS) transducer with good pulse-echo responses, in this paper, a finite element model (FEM) was built to simulate the transducer acoustic performances with different layer thicknesses. According to comparisons of the acoustic fields and the admittance curves, the optimum thickness parameters are gained. And then, an IVUS PZT transducer with controlled layer thicknesses was fabricated and tested. The results of pulse-echo response tests shown this transducer with the optimum parameters had very good performance. The central frequency is 45.5MHz and its bandwidth was about 50% which are suitable for intravascular imaging.
  • Keywords
    acoustic field; biomedical transducers; biomedical ultrasonics; blood vessels; ceramics; finite element analysis; lead compounds; ultrasonic materials testing; ultrasonic transducers; FEM; IVUS PZT transducer fabrication; IVUS PZT transducer layer thickness control; IVUS PZT transducer testing; IVUS transducer design; IVUS transducer layer thickness effect; PZT; acoustic field comparisons; admittance curve comparisons; bandwidth; central frequency; finite element model; frequency 45.5 MHz; frequency 50 MHz; intravascular imaging; intravascular ultrasound transducer; optimum thickness parameters; pulse-echo response tests; transducer acoustic performance simulation; Acoustic measurements; Acoustics; Admittance; Position measurement; Transducers; Ultrasonic imaging; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
  • Conference_Location
    Chicago, IL
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2014.6943648
  • Filename
    6943648