DocumentCode
1391484
Title
Global EMC and SI University in Pittsburgh at EMC 2012
Author
Bunting, C.
Author_Institution
Oklahoma State University
Volume
1
Issue
4
fYear
2012
Firstpage
73
Lastpage
74
Abstract
Electronic products today, in all applications, are still driven by the five important forces of faster, denser, cheaper, lower power, NOW! New design principles and technology options continually evolve to fuel these advances. Engineers at all levels, from beginner to expert, must constantly learn new solutions to keep up with new problems. The Global University Program was established to help engineers get a jump-start in advancing to their next level of understanding so they can apply solid engineering principles to practical design solutions.
fLanguage
English
Journal_Title
Electromagnetic Compatibility Magazine, IEEE
Publisher
ieee
ISSN
2162-2264
Type
jour
DOI
10.1109/MEMC.2012.6397062
Filename
6397062
Link To Document