• DocumentCode
    1391484
  • Title

    Global EMC and SI University in Pittsburgh at EMC 2012

  • Author

    Bunting, C.

  • Author_Institution
    Oklahoma State University
  • Volume
    1
  • Issue
    4
  • fYear
    2012
  • Firstpage
    73
  • Lastpage
    74
  • Abstract
    Electronic products today, in all applications, are still driven by the five important forces of faster, denser, cheaper, lower power, NOW! New design principles and technology options continually evolve to fuel these advances. Engineers at all levels, from beginner to expert, must constantly learn new solutions to keep up with new problems. The Global University Program was established to help engineers get a jump-start in advancing to their next level of understanding so they can apply solid engineering principles to practical design solutions.
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    2162-2264
  • Type

    jour

  • DOI
    10.1109/MEMC.2012.6397062
  • Filename
    6397062