DocumentCode
1391720
Title
Three-dimensional high-frequency distribution networks. II. Packaging and integration
Author
Henderson, Rashaunda M. ; Herrick, Katherine J. ; Weller, Thomas M. ; Robertson, S.V. ; Kihm, R.T. ; Katehi, Linda P B
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
Volume
48
Issue
10
fYear
2000
fDate
10/1/2000 12:00:00 AM
Firstpage
1643
Lastpage
1651
Abstract
This paper describes the implementation and packaging of the components, described in Part I of this paper, to realize a three-dimensional W-band distribution network
Keywords
coplanar waveguides; interconnections; micromachining; millimetre wave circuits; packaging; power combiners; 3D MM-wave distribution networks; CPW; EHF; W-band; packaging; three-dimensional distribution network; Distributed parameter circuits; Frequency; Laboratories; Micromachining; Microwave circuits; Microwave devices; Packaging; Performance loss; Power generation; Power transmission lines;
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/22.873891
Filename
873891
Link To Document