High combining-efficiency X-band spatial power-combined array using a multilayered packaging architecture

Author

Duffy, Sean M. ; Gouker, Mark A.

Author_Institution

Lincoln Lab., MIT, Lexington, MA, USA

Volume

48

Issue

10

fYear

2000

fDate

10/1/2000 12:00:00 AM

Firstpage

1769

Lastpage

1771

Abstract

The design of a high combining-efficiency spatial power-combined array is described in this paper. A multilayered stacked stripline architecture enables a compact stable design. An array incorporating antenna active impedance and proper amplifier matching is measured with a combining efficiency of 87%, radiating 6.8 W of an available 7.8 W into the ideal uniformly illuminated array directivity at 10.1 GHz

Keywords

MMIC amplifiers; active antenna arrays; antenna radiation patterns; impedance matching; losses; microstrip antenna arrays; packaging; power combiners; strip lines; 10.1 GHz; 6.8 W; 7.8 W; 87 percent; X-band power-combined array; amplifier matching; antenna active impedance matching; compact stable design; high combining efficiency; multilayered packaging architecture; multilayered stacked stripline architecture; spatial power-combined array; Antenna arrays; Circuits; Impedance; MMICs; Microwave antenna arrays; Packaging; Phased arrays; Power amplifiers; Power generation; Stripline;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.873909

Filename

873909