Title :
A New Power-Ground Plane Modeling Method With Rectangle and Triangle Segmentation
Author :
Liu, Chuntian ; Mao, Junfa ; Tang, Min
Author_Institution :
Dept. of Electron. Eng., Shanghai Jiao Tong Univ., Shanghai, China
Abstract :
A new power-ground modeling method combining rectangles and triangles partition is proposed for the analysis of the ground bounce noise in high-speed digital systems. In this method, the cavity model is used to analyze rectangular segments and the lumped model is used to analyze triangle meshes. The resultant inner virtual ports and simulation time can be reduced significantly. In addition, multilayered planes with apertures can be dealt with using the impedance matrix model. The results of this method are demonstrated to be accurate over a wide range of frequencies.
Keywords :
circuit noise; digital circuits; impedance matrix; mesh generation; network analysis; ground bounce noise analysis; high-speed digital systems; impedance matrix model; lumped model; multilayered planes; power-ground plane modeling method; rectangle segmentation; triangle mesh analysis; triangle segmentation; Cavity model; Delaunay triangular mesh; power-ground modeling; rectangle and triangle partition;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2009.2037603
