DocumentCode
1392737
Title
High-performance tantalum oxide capacitors fabricated by a novel reoxidation scheme
Author
Byeon, Sang Gi ; Tzeng, Yonhua
Author_Institution
Alabama Microelectron. Sci. & Technol. Center, Auburn Univ., AL, USA
Volume
37
Issue
4
fYear
1990
fDate
4/1/1990 12:00:00 AM
Firstpage
972
Lastpage
979
Abstract
High-performance tantalum oxide capacitors with excellent reliability that were developed by a two-step oxidation scheme are discussed. An anodic reoxidation process is applied to the reactively sputter-deposited tantalum oxide films to make the densified oxide structure. The electrical and physical properties as well as the reliability of these two-step oxidized sputtered/anodized tantalum oxide films are shown to be much superior to those of conventional tantalum oxide films prepared by either anodization or sputtering alone. Capacitors made of the sputtered/anodized tantalum oxide film have greatly improved electrical properties and better reliability than anodized or sputtered tantalum oxide capacitors and are very useful for applications to high-capacity storage capacitors in future high-density VLSI memories
Keywords
anodisation; metal-insulator-metal devices; oxidation; reliability; sputtered coatings; tantalum compounds; thin film capacitors; MIM device; Ta-Ta2O5-Al; Ta2O5 capacitors; anodic reoxidation; densified oxide structure; electric properties; high-capacity storage capacitors; high-density VLSI memories; physical properties; reactively sputtered films; reliability; reoxidation scheme; two-step oxidation; Aluminum oxide; Circuits; Dielectrics and electrical insulation; Electric breakdown; Leakage current; MOS capacitors; Oxidation; Random access memory; Sputtering; Very large scale integration;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.52432
Filename
52432
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