• DocumentCode
    1393232
  • Title

    A Physical-Location-Aware X-Filling Method for IR-Drop Reduction in At-Speed Scan Test

  • Author

    Hsieh, Wen-Wen ; Chen, Shih-Liang ; Lin, I-Sheng ; Hwang, TingTing

  • Author_Institution
    Taiwan Semicond. Manuf. Co. Ltd., Hsinchu, Taiwan
  • Volume
    29
  • Issue
    2
  • fYear
    2010
  • Firstpage
    289
  • Lastpage
    298
  • Abstract
    The IR-drop problem during test mode exacerbates delay defects and results in false failures. In this paper, we take the X-filling approach to reduce the IR-drop effect during an at-speed test. The main difference between our approach and the previous X-filling approaches lies in two aspects. The first one is that we take the spatial information into consideration in our approach. The second one is how X-filling is performed. We propose a backward-propagation technique instead of a forward-propagation approach taken in previous work. The experimental results show that our approach can reduce 21.1% of the maximum IR-drop in the best case and 9.1% on the average as compared to previous work.
  • Keywords
    automatic test pattern generation; electric potential; integrated circuit testing; integrated logic circuits; logic design; IR-drop reduction; at-speed scan test; automatic test pattern generation; backward-propagation technique; forward-propagation approach; physical-location-aware X-filling method; spatial information; Application specific integrated circuits; Automatic test pattern generation; Automatic testing; Chip scale packaging; Circuit testing; Delay; Fabrication; Integrated circuit yield; Test pattern generators; Timing; At-speed scan test; IR-drop; X-filling; automatic test pattern generation; physical location aware;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.2009.2035584
  • Filename
    5395734