DocumentCode :
139384
Title :
CLINATEC® BCI platform based on the ECoG-recording implant WIMAGINE® and the innovative signal-processing: Preclinical results
Author :
Eliseyev, Andrey ; Mestais, Corinne ; Charvet, Guillaume ; Sauter, Fabien ; Abroug, Neil ; Arizumi, Nana ; Cokgungor, Serpil ; Costecalde, Thomas ; Foerster, Michael ; Korczowski, Louis ; Moriniere, Boris ; Porcherot, Jean ; Pradal, Jeremy ; Ratel, David
Author_Institution :
LETI, CEA, Grenoble, France
fYear :
2014
fDate :
26-30 Aug. 2014
Firstpage :
1222
Lastpage :
1225
Abstract :
The goal of the CLINATEC® Brain Computer Interface (BCI) Project is to improve tetraplegic subjects´ quality of life by allowing them to interact with their environment through the control of effectors, such as an exoskeleton. The BCI platform is based on a wireless 64-channel ElectroCorticoGram (ECoG) recording implant WIMAGINE®, designed for long-term clinical application, and a BCI software environment associated to a 4-limb exoskeleton EMY (Enhancing MobilitY). Innovative ECoG signal decoding algorithms will allow the control of the exoskeleton by the subject´s brain activity. Currently, the whole BCI platform was tested in real-time in preclinical experiments carried out in nonhuman primates. In these experiments, the exoskeleton arm was controlled by means of the decoded neuronal activity.
Keywords :
brain-computer interfaces; electroencephalography; medical signal processing; neurophysiology; prosthetics; 4-limb exoskeleton; BCI software environment; CLINATEC BCI platform; ECoG signal decoding algorithms; ECoG-recording implant; EMY; WIMAGINE; brain activity; brain computer interface; decoded neuronal activity; electrocorticogram recording implant; exoskeleton arm; non-human primates; signal-processing; Decoding; Electrodes; Exoskeletons; Implants; Signal processing algorithms; Software; Wireless communication;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location :
Chicago, IL
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2014.6943817
Filename :
6943817
Link To Document :
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