• DocumentCode
    1394589
  • Title

    Fully coupled dynamic electro-thermal simulation

  • Author

    Digele, Georg ; Lindenkreuz, Steffi ; Kasper, Erich

  • Author_Institution
    Inst. of Semicond. Eng., Stuttgart Univ., Germany
  • Volume
    5
  • Issue
    3
  • fYear
    1997
  • Firstpage
    250
  • Lastpage
    257
  • Abstract
    Fully coupled dynamic electro-thermal simulation on chip and circuit level is presented. Temperature dependent thermal conductivity of silicon is taken into account, thus solving the nonlinear heat diffusion equation. The numerical solution is carried out by using the industry-standard simulator SABER, therefore for electro-thermal simulations we are able to use the common electrical compact models by adding a heat source and thermal pins to them. The application of this technique and need for electro-thermal simulation is illustrated with the simulation of a current control circuit built into a multiwatt package.
  • Keywords
    VLSI; circuit analysis computing; digital simulation; integrated circuit design; integrated circuit modelling; integrated circuit packaging; thermal conductivity; thermal diffusion; SABER; VLSI; current control circuit; dynamic electro-thermal simulation; electrical compact models; industry-standard simulator; multiwatt package; nonlinear heat diffusion equation; temperature dependent thermal conductivity; Circuit simulation; Coupling circuits; Electric current control; Nonlinear equations; Packaging; Pins; Resistance heating; Silicon; Temperature dependence; Thermal conductivity;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/92.609867
  • Filename
    609867