DocumentCode
1394589
Title
Fully coupled dynamic electro-thermal simulation
Author
Digele, Georg ; Lindenkreuz, Steffi ; Kasper, Erich
Author_Institution
Inst. of Semicond. Eng., Stuttgart Univ., Germany
Volume
5
Issue
3
fYear
1997
Firstpage
250
Lastpage
257
Abstract
Fully coupled dynamic electro-thermal simulation on chip and circuit level is presented. Temperature dependent thermal conductivity of silicon is taken into account, thus solving the nonlinear heat diffusion equation. The numerical solution is carried out by using the industry-standard simulator SABER, therefore for electro-thermal simulations we are able to use the common electrical compact models by adding a heat source and thermal pins to them. The application of this technique and need for electro-thermal simulation is illustrated with the simulation of a current control circuit built into a multiwatt package.
Keywords
VLSI; circuit analysis computing; digital simulation; integrated circuit design; integrated circuit modelling; integrated circuit packaging; thermal conductivity; thermal diffusion; SABER; VLSI; current control circuit; dynamic electro-thermal simulation; electrical compact models; industry-standard simulator; multiwatt package; nonlinear heat diffusion equation; temperature dependent thermal conductivity; Circuit simulation; Coupling circuits; Electric current control; Nonlinear equations; Packaging; Pins; Resistance heating; Silicon; Temperature dependence; Thermal conductivity;
fLanguage
English
Journal_Title
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher
ieee
ISSN
1063-8210
Type
jour
DOI
10.1109/92.609867
Filename
609867
Link To Document