Title :
Realistic and efficient simulation of electro-thermal effects in VLSI circuits
Author :
Sabry, Mohamed-Nabil ; Bontemps, Anne ; Aubert, Veronique ; Vahrmann, Reinhold
Author_Institution :
ANACAD, Meylan, France
Abstract :
Needs for electro-thermal simulation of VLSI circuits, as opposed to both the system and device levels, are analyzed. A system capable of modeling these effects in a realistic and sufficiently accurate way that uses a reasonable amount of CPU resources is presented. An innovative solver is also proposed. The system is used to study the importance of some three dimensional (3-D) effects as well as metallic connections. A complete example was treated to have an insight on the type of results to be expected and the corresponding costs in terms of CPU.
Keywords :
VLSI; boundary-elements methods; circuit analysis computing; digital simulation; integrated circuit modelling; CPU resources; VLSI circuits; costs; electro-thermal effects; electro-thermal simulation; metallic connections; three dimensional effects; Analytical models; Central Processing Unit; Circuit simulation; Costs; Delay estimation; Heat transfer; Mirrors; Resistance heating; Very large scale integration; Voltage;
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
