Title :
Accuracy counts in modeling TCAD´s future
Author :
Biegel, Bryan A.
Author_Institution :
Numerical Aerosp. Simulation Div., NASA Ames Res. Center, Moffett Field, CA, USA
Abstract :
We are on the path to meet the major challenges ahead for TCAD. The emerging computational grid will ultimately solve the challenge of limited computational power. The Modular TCAD Framework will solve the TCAD software challenge once more developers agree to cooperate. This framework also provides the ideal platform for rapid implementation of the many models needed in a partial differential equation solver
Keywords :
partial differential equations; semiconductor device models; semiconductor process modeling; software tools; technological forecasting; technology CAD (electronics); TCAD software challenge; computational grid; device modeling; device simulation; future prediction; intelligent TCAD; modular TCAD framework; partial differential equation solver; process simulation; rapid implementation; virtual fab; Atomic layer deposition; Circuit simulation; Circuit testing; Electrons; Integrated circuit interconnections; Integrated circuit layout; Integrated circuit technology; MOSFET circuits; Semiconductor process modeling; Silicon on insulator technology;
Journal_Title :
Potentials, IEEE
