Title :
Packaging and Assembly for Integrated Photonics—A Review of the ePIXpack Photonics Packaging Platform
Author :
Zimmermann, Lars ; Preve, Giovan Battista ; Tekin, Tolga ; Rosin, Thomas ; Landles, Kennedy
Author_Institution :
Leibniz-Inst., IHP Microelectron., Frankfurt (Oder), Germany
Abstract :
We review recent work done by the photonics packaging platform ePIXpack that serves the academic community with packaging and assembly developments in the area of integrated photonics. The paper includes recent examples of our packaging and assembly work, covering a broad range of technologies from silicon photonics to InP-based devices.
Keywords :
III-V semiconductors; elemental semiconductors; indium compounds; integrated optics; integrated optoelectronics; silicon; wafer level packaging; InP; Si; assembly developments; ePIXpack photonics packaging; integrated photonics; silicon photonics; Assembly; Couplings; Optical waveguides; Packaging; Photonics; Radio frequency; Silicon; Hybrid integrated-circuit packaging; photonic integration; silicon-on-insulator (SOI);
Journal_Title :
Selected Topics in Quantum Electronics, IEEE Journal of
DOI :
10.1109/JSTQE.2010.2084992
