• DocumentCode
    1395232
  • Title

    Characteristics of p- and n-channel poly-Si/Si1-xGex/Si sandwiched conductivity modulated thin-film transistors

  • Author

    Zhu, Chunxiang ; Sin, Johnny K O ; Hoi-Sing Hwok

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., China
  • Volume
    47
  • Issue
    11
  • fYear
    2000
  • fDate
    11/1/2000 12:00:00 AM
  • Firstpage
    2188
  • Lastpage
    2193
  • Abstract
    Both p- and n-channel poly-Si/Si1-xGex/Si sandwiched conductivity modulated thin-film transistors (CMTFTs) are demonstrated and experimentally characterized. The transistors use a poly-Si/Si1-xGex/Si sandwiched structure as the active layer to avoid the poor interface between the gate oxide and the poly-Si1-xGex material. Also an offset region placed between the channel and the drain is used to reduce the leakage current. Furthermore, the concept of conductivity modulation in the offset region is used to provide a high on-state current. Results show that the transistors provide a high on-state current as well as a low leakage current compared to those of conventional offset drain TFTs. The p- and n-channel CMTFTs can be combined to form CMOS drivers, which are very suitable for use in low temperature large area electronic systems on glass applications
  • Keywords
    Ge-Si alloys; cryogenic electronics; electrical conductivity transitions; elemental semiconductors; leakage currents; semiconductor materials; silicon; thin film transistors; CMTFTs; Si-SiGe-Si; active layer; conductivity modulation; gate oxide; large area electronic systems on glass; leakage current; low temperature systems; offset region; on-state current; sandwiched conductivity modulated thin-film transistors; Conducting materials; Conductivity; Driver circuits; Germanium silicon alloys; Glass; Leakage current; Plasma temperature; Silicon germanium; Substrates; Thin film transistors;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.877182
  • Filename
    877182