DocumentCode
1395239
Title
Injection efficiency of CHISEL gate currents in short MOS devices: physical mechanisms, device implications, and sensitivity to technological parameters
Author
Esseni, David ; Selmi, Luca ; Ghetti, Andrea ; Sangiorgi, Enrico
Author_Institution
DIEGM, Udine, Italy
Volume
47
Issue
11
fYear
2000
fDate
11/1/2000 12:00:00 AM
Firstpage
2194
Lastpage
2200
Abstract
This paper analyzes MOSFET gate currents in the so-called channel initiated secondary electron injection regime (CHISEL). A Monte Carlo model of the phenomenon is validated and then extensively used to explore CHISEL scaling laws. Results indicate that, compared to conventional channel hot electron injection (CHE), CHISEL exhibits a weaker dependence on channel length and a larger sensitivity to short channel effects. These results are confirmed experimentally and exhaustively explained with the help of simulations; furthermore, some of their possible detrimental consequences on the programming efficiency of CHISEL based flash cells are analyzed. Finally, the impact of channel doping, oxide thickness, and junction depth on CHISEL efficiency has been explored, and guidelines to maintain high injection efficiency in short devices are derived
Keywords
MOSFET; Monte Carlo methods; doping profiles; flash memories; hot carriers; semiconductor device models; CHISEL gate currents; MOSFET gate currents; Monte Carlo model; channel doping; channel initiated secondary electron injection regime; channel length; device implications; flash cells; injection efficiency; junction depth; oxide thickness; physical mechanisms; programming efficiency; scaling laws; short MOS devices; technological parameters; Analytical models; Channel hot electron injection; Impact ionization; MOS devices; MOSFETs; Monte Carlo methods; Nonvolatile memory; Paper technology; Silicon; Voltage;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.877183
Filename
877183
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