DocumentCode
1395433
Title
The deposition of TiN thin films by filtered cathodic arc techniques
Author
Martin, Philip J. ; Bendavid, Avi ; Kinder, Terrence J.
Author_Institution
Div. of Telecommun. & Ind. Phys., CSIRO, Lindfield, NSW, Australia
Volume
25
Issue
4
fYear
1997
fDate
8/1/1997 12:00:00 AM
Firstpage
675
Lastpage
679
Abstract
A filtered cathodic arc source has been used to deposit thin films of titanium nitride. The properties of the films are influenced by the nature of the condensation process. TiN films may be deposited directly onto heated substrates in a nitrogen atmosphere or onto unbiased substrates at ambient temperature by condensing the Ti+ ion beam under 500 eV N2+ nitrogen ion bombardment. In the latter case, the film stoichiometry was varied from an N:Ti ratio of 0.8 to 1.2 by controlling the relative arrival rates of Ti and nitrogen ions. Simple models are used to describe the evolution of compressive stress as a function of arrival ratio and the composition of the N2 + ion-assisted TiN films
Keywords
arcs (electric); cathodes; condensation; filters; ion beam applications; plasma deposited coatings; plasma deposition; stoichiometry; titanium compounds; vacuum arcs; 500 eV; N2; N2+; Ti; Ti-N2; Ti+ ion beam; TiN; TiN films; TiN thin films; ambient temperature; arrival ratio; composition; compressive stress; condensation process; deposition; film stoichiometry; filtered cathodic arc techniques; heated substrates; relative arrival rates; unbiased substrates; Cathodes; Compressive stress; Ion beams; Nitrogen; Plasma sources; Plasma temperature; Sputtering; Substrates; Tin; Titanium;
fLanguage
English
Journal_Title
Plasma Science, IEEE Transactions on
Publisher
ieee
ISSN
0093-3813
Type
jour
DOI
10.1109/27.640684
Filename
640684
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