• DocumentCode
    1395433
  • Title

    The deposition of TiN thin films by filtered cathodic arc techniques

  • Author

    Martin, Philip J. ; Bendavid, Avi ; Kinder, Terrence J.

  • Author_Institution
    Div. of Telecommun. & Ind. Phys., CSIRO, Lindfield, NSW, Australia
  • Volume
    25
  • Issue
    4
  • fYear
    1997
  • fDate
    8/1/1997 12:00:00 AM
  • Firstpage
    675
  • Lastpage
    679
  • Abstract
    A filtered cathodic arc source has been used to deposit thin films of titanium nitride. The properties of the films are influenced by the nature of the condensation process. TiN films may be deposited directly onto heated substrates in a nitrogen atmosphere or onto unbiased substrates at ambient temperature by condensing the Ti+ ion beam under 500 eV N2+ nitrogen ion bombardment. In the latter case, the film stoichiometry was varied from an N:Ti ratio of 0.8 to 1.2 by controlling the relative arrival rates of Ti and nitrogen ions. Simple models are used to describe the evolution of compressive stress as a function of arrival ratio and the composition of the N2 + ion-assisted TiN films
  • Keywords
    arcs (electric); cathodes; condensation; filters; ion beam applications; plasma deposited coatings; plasma deposition; stoichiometry; titanium compounds; vacuum arcs; 500 eV; N2; N2+; Ti; Ti-N2; Ti+ ion beam; TiN; TiN films; TiN thin films; ambient temperature; arrival ratio; composition; compressive stress; condensation process; deposition; film stoichiometry; filtered cathodic arc techniques; heated substrates; relative arrival rates; unbiased substrates; Cathodes; Compressive stress; Ion beams; Nitrogen; Plasma sources; Plasma temperature; Sputtering; Substrates; Tin; Titanium;
  • fLanguage
    English
  • Journal_Title
    Plasma Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-3813
  • Type

    jour

  • DOI
    10.1109/27.640684
  • Filename
    640684