• DocumentCode
    1395586
  • Title

    Variability Aware Low-Power Delay Optimal Buffer Insertion for Global Interconnects

  • Author

    Narasimhan, Ashok ; Sridhar, Ramalingam

  • Author_Institution
    Univ. at Buffalo (SUNY), Buffalo, NY, USA
  • Volume
    57
  • Issue
    12
  • fYear
    2010
  • Firstpage
    3055
  • Lastpage
    3063
  • Abstract
    Global interconnect delay variations may cause clock skew, unpredictable signal line delays, and degraded system performance. Conventional variation mitigation techniques incur large delay and power overheads, as variability increases in sub-65 nm technologies. This paper presents a methodology to include robustness optimization in power-delay optimal buffer insertion. Closed form expressions are derived for the delay variation model used in the optimization and its accuracy is verified against simulation results. Using the power, delay, and delay variation models, a design space is constructed for the interconnect. Through power-robustness trade-off analysis of the design space, the optimal buffering solution for the interconnect is computed. Comparison with simulation results verifies the accuracy of the optimal solution computed using this method. The application of this methodology in enhancing robustness of clock networks during buffer insertion phase is demonstrated and simulation results presented.
  • Keywords
    buffer circuits; circuit optimisation; integrated circuit interconnections; integrated circuit modelling; low-power electronics; clock networks; clock skew; closed form expressions; global interconnects; power overheads; power-delay optimal buffer insertion; power-robustness trade-off analysis; signal line delays; size 65 nm; variability aware low-power delay optimal buffer insertion; Capacitance; Integrated circuit interconnections; Propagation delay; Robustness; Delay variation; interconnect delay; low power; optimal buffer insertion; variability;
  • fLanguage
    English
  • Journal_Title
    Circuits and Systems I: Regular Papers, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1549-8328
  • Type

    jour

  • DOI
    10.1109/TCSI.2010.2073790
  • Filename
    5658174