DocumentCode
1395586
Title
Variability Aware Low-Power Delay Optimal Buffer Insertion for Global Interconnects
Author
Narasimhan, Ashok ; Sridhar, Ramalingam
Author_Institution
Univ. at Buffalo (SUNY), Buffalo, NY, USA
Volume
57
Issue
12
fYear
2010
Firstpage
3055
Lastpage
3063
Abstract
Global interconnect delay variations may cause clock skew, unpredictable signal line delays, and degraded system performance. Conventional variation mitigation techniques incur large delay and power overheads, as variability increases in sub-65 nm technologies. This paper presents a methodology to include robustness optimization in power-delay optimal buffer insertion. Closed form expressions are derived for the delay variation model used in the optimization and its accuracy is verified against simulation results. Using the power, delay, and delay variation models, a design space is constructed for the interconnect. Through power-robustness trade-off analysis of the design space, the optimal buffering solution for the interconnect is computed. Comparison with simulation results verifies the accuracy of the optimal solution computed using this method. The application of this methodology in enhancing robustness of clock networks during buffer insertion phase is demonstrated and simulation results presented.
Keywords
buffer circuits; circuit optimisation; integrated circuit interconnections; integrated circuit modelling; low-power electronics; clock networks; clock skew; closed form expressions; global interconnects; power overheads; power-delay optimal buffer insertion; power-robustness trade-off analysis; signal line delays; size 65 nm; variability aware low-power delay optimal buffer insertion; Capacitance; Integrated circuit interconnections; Propagation delay; Robustness; Delay variation; interconnect delay; low power; optimal buffer insertion; variability;
fLanguage
English
Journal_Title
Circuits and Systems I: Regular Papers, IEEE Transactions on
Publisher
ieee
ISSN
1549-8328
Type
jour
DOI
10.1109/TCSI.2010.2073790
Filename
5658174
Link To Document